1. Ceramic-filled-glass composite sintering;Ewsuk;Ceramic Transactions,1990
2. Low dielectric constant new materials for multilayer ceramic substrate;Kata;IEEE Trans. Compon., Hybrids, Manuf. Techn.,1990
3. Ceramic and glass-ceramic packaging in the 1990s;Tummala;J. Am. Ceram. Soc.,1991
4. Overview of the glass-ceramic/copper substrate—a high-performance multilayer package for the 1990s;Knickerbocker;Am. Ceram. Soc. Bull.,1992
5. Cordierite glass-ceramics for multilayer ceramic packaging;Knickerbocker;Am. Ceram. Soc. Bull.,1993