Multilayer thick-film technology as applied to design of microwave devices-Reference-Cited by-同舟云学术

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Multilayer thick-film technology as applied to design of microwave devices

Published:2007-01 Issue:8-9 Volume:27 Page:2941-2944
ISSN:0955-2219
Container-title:Journal of the European Ceramic Society
language:en
Short-container-title:Journal of the European Ceramic Society

Author:

Kapitanova Polina V.,Simine Alexander V.,Kholodnyak Dmitry V.,Vendik Irina B.

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference5 articles.

1. Design of an LTCC switch diplexer front-end module for GSM/DCS/PCS applications;Lucero,2001

2. 3D integrated LTCC module using BGA technology for compact C-band RF front-end module;Pinel,2002

3. Highly-integrated LTCC front-end-modules for Bluetooth and wireless-LAN applications;Heide,2003

4. Novel small-size LTCC-based WLAN frontend-modules with integrated power amplifiers;Chernyakov,2004

5. Application of sandwich multilayer technology to MICs design;Kapitanova,2005

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microwave Metamaterial Circuits;Wiley Encyclopedia of Electrical and Electronics Engineering;2014-09-16

2. Metamaterials and their application in microwaves: A review;Technical Physics;2013-01

3. Layered composite thick films for dielectric applications;Journal of the European Ceramic Society;2012-12

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