Author:
Subodh G.,Pavithran C.,Mohanan P.,Sebastian M.T.
Subject
Materials Chemistry,Ceramics and Composites
Reference24 articles.
1. Electronic packaging materials and there properties;Pecht,1999
2. Materials for electronic packaging;Chung,1995
3. Ceramic and glass ceramic packaging in 1990's;Tummala;J. Am. Ceram. Soc.,1991
4. Ceramic fiber polymer composites for electronic substrates;Bolt;Mater. Sci. Eng. A.,1989
5. Dielectric properties of polymers at microwave frequencies;Bur;Polymer,1985
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