Author:
Subodh G.,Pavithran C.,Mohanan P.,Sebastian M.T.
Subject
Materials Chemistry,Ceramics and Composites
Reference24 articles.
1. Electronic packaging materials and there properties;Pecht,1999
2. Materials for electronic packaging;Chung,1995
3. Ceramic and glass ceramic packaging in 1990's;Tummala;J. Am. Ceram. Soc.,1991
4. Ceramic fiber polymer composites for electronic substrates;Bolt;Mater. Sci. Eng. A.,1989
5. Dielectric properties of polymers at microwave frequencies;Bur;Polymer,1985
Cited by
67 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献