Heterogeneous diamond–TiC composites with high fracture toughness and electrical conductivity-Reference-Cited by-同舟云学术

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Heterogeneous diamond–TiC composites with high fracture toughness and electrical conductivity

Published:2024-07 Issue:8 Volume:44 Page:4887-4894
ISSN:0955-2219
Container-title:Journal of the European Ceramic Society
language:en
Short-container-title:Journal of the European Ceramic Society

Author:

Zhou Liang^ORCID,Li Yuanyuan,Kou Zili,Zheng Linpeng,Li Qian,Ma Guolong,Zhang Youjun^ORCID,He Duanwei^ORCID

Funder

National Key Laboratory of Shock Wave and Detonation Physics

Publisher

Elsevier BV

Reference65 articles.

1. Nanocrystalline cubic silicon carbide: A route to superhardness;Sun;Small,2022

2. A novel method for measuring and analyzing the interaction between drill bit and rock;Wang;Measurement,2018

3. Comparison of tribological behaviors of polycrystalline diamonds synthesized by titanium-and boron-coated diamond particles;Sha;Diam. Relat. Mater.,2022

4. Heterogeneous diamond-cBN composites with superb toughness and hardness;Li;Nano Lett.,2022

5. A strong, lightweight, and damping cermet material with a nacre-like ultrafine 3D interpenetrated architecture;Liu;Mater. Today,2023

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