Arbuscular mycorrhizal fungi alleviate erosion-induced soil nutrient losses in experimental agro-ecosystems
Author:
Publisher
Elsevier BV
Subject
Earth-Surface Processes
Reference96 articles.
1. Investigating the role of raindrop impact on hydrodynamic mechanism of soil erosion under simulated rainfall conditions;An;Soil Sci.,2012
2. Splash erosion under natural rainfall on three soil types in NE Spain;Angulo-Martínez;Geomorphology,2012
3. Arbuscular mycorrhizas enhance plant interception of leached nutrients;Asghari;Funct. Plant Biol.,2011
4. Influence of arbuscular mycorrhizal (AM) symbiosis on phosphorus leaching through soil cores;Asghari;Plant Soil,2005
5. Effect of crop rotation on mycorrhizal colonization and wheat yield under different fertilizer treatments;Bakhshandeh;Agric. Ecosyst. Environ.,2017
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