Can infrared thermography be used to estimate soil surface microrelief and rill morphology?
Author:
Publisher
Elsevier BV
Subject
Earth-Surface Processes
Reference45 articles.
1. Total porosity and random roughness of the interrow zone as influenced by tillage;Allmaras,1966
2. A review of runoff generation and soil erosion across scales in semiarid south-eastern Spain;Cantón;J. Arid. Environ.,2011
3. Ground-based thermography of fluvial systems at low and high discharge reveals potential complex thermal heterogeneity driven by flow variation and bioroughness;Cardenas;Hydrol. Process.,2008
4. The analysis of soil surface roughness;Currence;Trans. ASAE,1970
5. The integration of thermal infrared imaging, discharge measurements and numerical simulation to quantify the relative contributions of freshwater inflows to small estuaries in Atlantic Canada;Danielescu;Hydrol. Process.,2009
Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effects of rill morphology characteristics on particle size selectivity using indoor simulation experiments with two types of soil from the Loess Plateau;Journal of Soils and Sediments;2024-09-09
2. Estimation of topsoil moisture and hydraulic conductivity using infrared thermography in the Brazilian semiarid;Engenharia Sanitaria e Ambiental;2023
3. Measurement of water content at bare soil surface with infrared thermal imaging technology;Journal of Hydrology;2022-12
4. Evolution of Surface Drainage Network for Spoil Heaps under Simulated Rainfall;Water;2021-12-06
5. Quantifying Shallow Overland Flow Patterns Under Laboratory Simulations Using Thermal and LiDAR Imagery;Water Resources Research;2021-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3