New silicon micromachining techniques for microsystems-Reference-Cited by-同舟云学术

New silicon micromachining techniques for microsystems

Published:1997-07 Issue:1-3 Volume:62 Page:652-662
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

French P.J.,Gennissen P.T.J.,Sarro P.M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Anisotropic etching of silicon;Bean;IEEE Trans. Electron Devices,1978

2. Groove depth uniformization in (110) Si anisotropic etching by ultrasonic wave and application to accelerometer fabrication;Ohwada,1995

3. Anisotropic etching of crystalline silicon in alkaline solution; Part 1 orientation dependence and behavior of passivation layers; Part II influence of dopants;Seidel;J. Electrochem. Soc.,1990

4. TMAH/IPA anisotropic etching characteristics;Merlos;Sensors and Actuators A,1993

5. Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvano forming and plastic moulding (LIGA process);Becket;Microeleetronic Eng.,1986

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