Experimental adaptation of model parameters for microelectromechanical systems (MEMS)-Reference-Cited by-同舟云学术

Experimental adaptation of model parameters for microelectromechanical systems (MEMS)

Published:1997-07 Issue:1-3 Volume:62 Page:760-764
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Kurth S.,Dötzel W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference8 articles.

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3. Characterization of the electrostatic bonding of silicon and Pyrex glass;Cozma;J. Micromech. Microeng.,1995

4. Circuit simulation model of gas damping in microstructures with nontrivial geometries;Veijola,1996

5. Design and technology of a mirror-array in silicon-micromechanics;Gessner,1996

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4. Dynamic Analyses of Membranes and Thin Films on Wafer Level;2007 IEEE International Conference on Microelectronic Test Structures;2007-03

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