1. An integrated three-axis accelerometer using CMOS compatible stress sensitive differential amplifiers;Takao;IEEE Trans. Electron Dev.,1999
2. H. Xie, G.K. Fedder, A CMOS z-axis capacitive accelerometer with comb-finger sensing, in: Proceedings of the 13th IEEE International Workshop on Micro Electro Mechanical Systems ‘MEMS 2000’, Miyazaki, Japan, January 23–27, 2000, pp. 26–32.
3. An RIE process for submicron silicon electromechanical structures;Zhang;J. Micromech. Microeng.,1992
4. U. Sridhar, et al., Single crystal silicon microstructures using trench isolation, in: Proceedings of the Conference on Transducers ’99, Sendai, Japan, June 7–10, 1999, Technical Digest, pp. 258–261.
5. M.A. Lemkin, T.N. Juneau, W.A. Clark, T.A. Roessig, T.J. Brosnihan, A low-noise digital accelerometer using integrated SOI-MEMS technology, in: Proceedings of the Conference on Transducers ’99, Sendai, Japan, June 7–10, 1999, Technical Digest, pp. 1294–1297.