MEMS device for bending test: measurements of fatigue and creep of electroplated nickel-Reference-Cited by-同舟云学术

MEMS device for bending test: measurements of fatigue and creep of electroplated nickel

Published:2003-01 Issue:1-2 Volume:103 Page:156-164
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Larsen Kristian P.,Rasmussen Anette A.,Ravnkilde Jan T.,Ginnerup Morten,Hansen Ole

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference20 articles.

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5. M.P. deBoer, B.D. Jensen, F. Bitsie, A small area in situ MEMS test structure to measure fracture strength by electrostatic probing, vol. 3875, in: Proceedings of the Part of the SPIE Conference on Materials and Device Characterization on Micromachining, Part II, SPIE, September 1999, p. 97–102.

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