Author:
Makarova Olga V.,Mancini Derrick C.,Moldovan Nicolaie,Divan Ralu,Tang Cha-Mei,Ryding David G.,Lee Richard H.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Adhesion problems in deep-etch X-ray lithography caused by fluorescence radiation from the plating base;Pantenburg;Microelectr. Eng.,1994
2. Enhanced adhesion buffer layer for deep X-ray lithography using hard X-rays;DeCarlo;J. Vac. Sci. Technol. B,1998
3. Alternative resist adhesion and electroplating layers for LIGA process;El-Kholi;Microsyst. Technol.,2000
4. Graphite-based X-ray masks for deep and ultra-deep X-ray lithography;Coane;J. Vac. Sci. Technol. B,1998
5. H. Guckel, T.R. Christenson, K. Skrobis, Formation of microstructures using a preformed photoresist, US Patent 5,378,583 (1995).
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