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2. Microfabrication of 3D multidirectional inclined structures by UV lithography and electroplating;Beuret,1993
3. Micromachining applications of a high resolution ultrathick photoresist;Lee;J. Vac. Sci. Technol. B,1995
4. Development of a fine pitch bumping process;Engelmann,1990
5. Semiconductor Lithography Principles, Practices and Materials;Moreau,1988