Silicon/glass wafer-to-wafer bonding with Ti/Ni intermediate bonding

Author:

Xiao Zhi-Xiong,Wu Guo-Ying,Zhang Dacheng,Zhang Guobing,Li Zhi-Hong,Hao Yi-Long,Wang Yang-Yuan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference12 articles.

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4. Direct silicidation of Co on Si by rapid thermal annealing;Tabasky;IEEETrans. Electron Devices,1987

5. T. Morimoto, H.S. Momose, T. Iinuma, I. Kunishima, K. Suguro, H. Okano, I. Katakabe, H. Nakajima, H. Tsuchiaki, M. Tsuchiaki, M. Ono, Y. Katsumata, H. Iwai, A NiSi silicide technology for advanced logic devices, IEDM 91, p. 653,

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1. A Low-Temperature Nickel Silicide Process for Wafer Bonding and High-Density Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05

2. Wafer Bonding;Reference Module in Materials Science and Materials Engineering;2016

3. Wafer Bonding;Comprehensive Microsystems;2008

4. Development of a neutron guide tube production technique at KAERI;Physica B: Condensed Matter;2006-11

5. Wafer Bonding Techniques for MEMS;Sensor Letters;2005-12-01

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