Micro-springs for temporary chip connections-Reference-Cited by-同舟云学术

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Micro-springs for temporary chip connections

Published:2000-08 Issue:1-3 Volume:85 Page:371-376
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Krüger C,Bartelink D.J,Fritz T,Leuerer T,Mokwa W,Schnakenberg U

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Direktmontage;Reichl,1998

2. A unified approach to chip, test, and assembly technologies for MCMs;Bartelink,1995

3. D. J. Bartelink, SRC White Paper on Integrated Systems, Semiconductor Research, Feb. 1996.

4. Integrated Systems;Bartelink;IEEE Trans. Electron Devices,1996

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. EFFECT OF SPECIMEN SIZE ON YOUNG'S MODULUS OF ELECTRODEPOSITED Ni;Surface Review and Letters;2009-04

2. Analysis, simulation and fabrication of MEMS springs for a micro-tensile system;Journal of Micromechanics and Microengineering;2008-12-10

3. A micro-tensile method for measuring mechanical properties of MEMS materials;Journal of Micromechanics and Microengineering;2008-04-25

4. Platform for Temporary Testing of Hybrid Microsystems at High Frequencies;Journal of Microelectromechanical Systems;2007-12

5. HF-contact elements for testing and multi chip module applications;Microsystem Technologies;2006-03-16

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