Electroforming of 3D microstructures on highly structured surfaces

Author:

Johansen L.S.,Ginnerup M.,Ravnkilde J.T.,Tang P.T.,Löchel B.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. X-ray exposures of electro-deposited photoresist for conformal lithography on corrugated surfaces;Hartley;Proc. SPIE,1998

2. Wafer through-hole interconnections with high vertical wiring densities;Christensen;IEEE Trans. on Components, Packaging, and Manufacturing Technology: Part A,1996

3. Photolithography in anisotropically etched grooves;Lindner,1996

4. Single-chip condensor microphone using porous silicon as sacrificial layer for the air gap;Kronast,1998

5. Decreasing the optical path length in an optoelectronic module using silicon micromachining;Rangsten,1998

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