1. C.T.-C. Nguyen, Microelectromechanical components for miniaturized low-power communications, in: Proceedings of the 1999 IEEE MTT-S International Microwave Symposium RF-MEMS Workshop on Microelectromechanical Devices for Systems: Their Construction, Reliability, and Application, Anaheim, CA, USA, 18 June 1999, pp. 48–77.
2. J.J. Yao M.F. Chang, A surface micromachined miniature switch for telecommunications applications with signal frequencies from dc up to 4 GHz, in: Technical Digest of the 8th International Conference on Solid-State Sensors and Actuators (Transducers’95), and Eurosensors IX, Stockholm, Sweden, 25–29 June 1995, pp. 384–387.
3. X.Q. Sun, X. Gu, W.N. Carr, A bistable microrelay based on two-segment multimorph cantilever actuators, in: Proceedings of the IEEE 11th Annual International Workshop on Micro Electro Mechanical Systems, Heidelberg, Germany, 25–29 January 1998, pp. 154–159.
4. M.-A. Grétillat, F. Grétillat, N.F. de Rooij, Micromechanical relay with electrostatic actuation and metallic contacts, in: Technical Digest of the 10th International Conference on Solid-State Sensors and Actuators (Transducers’99), Sendai, Japan, 7–10 June 1999.
5. S.-C. Shen, M.Feng, Low actuation voltage RF-MEMS switches with signal frequencies from 0.25 to 40 GHz, in: Proceedings of the International Electronic Devices Meeting 1999, WA, USA, 5–8 December 1999, pp. 689–692.