A study of stress propagation under impact loading using double exposure speckle photography and finite element analysis
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. Strain analysis by one-beam laser speckle interferometry 2: Multiaperture method
2. Strain analysis by one-beam laser speckle interferometry 1: Single aperture method
3. Finite Element Method in Elastic and Plastic Mechanics;Xie,1983
4. Proceedings of the International Conference on Experimental Mechanics;Li,1985
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Determination of strain and stress distribution on shearwalls by using the speckle photography technique;Optics and Lasers in Engineering;2003-05
2. Strains and stress distribution on the shearwall by speckle photography technique;4th Iberoamerican Meeting on Optics and 7th Latin American Meeting on Optics, Lasers, and Their Applications;2001-08-14
3. Study on in‐plane displacement measurement under impact loading using digital speckle pattern interferometry;Optical Engineering;1996-04-01
4. Study on out-off-plane displacement measurement using DSPI under impact loading;Measurement;1996-04
5. Determination of dynamic three-dimensional displacement fields on a shell surface;Optics and Lasers in Engineering;1991-01
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