Photoelastic study of interfacial fracture of bimaterial-Reference-Cited by-同舟云学术

Photoelastic study of interfacial fracture of bimaterial

Published:1991-01 Issue:3 Volume:14 Page:217-234
ISSN:0143-8166
Container-title:Optics and Lasers in Engineering
language:en
Short-container-title:Optics and Lasers in Engineering

Author:

Lu Hua,Chiang F.P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Measurement of displacement field around an interfacial crack in a bimaterial sheet;Chiang,1988

2. Paper presented at the symposium on Interfacial Phenomena in Composites: Processing, Characterization and Mechanical Properties, held at Salve Regina College,1988

3. Experimental evaluation of stress concentration and intensity factors;Smith,1981

4. The stress around a fault or crack in dissimilar media;Williams;Bulletin of the Seismological Society of America,1959

5. Stress distribution in a nonhomogeneous elastic plane with cracks;Erdogan;Journal of Applied Mechanics,1963

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