Additive-free electroless deposition on graphene/copper foil: Photo-induced and defect-assisted approach for environmentally friendly plating-Reference-Cited by-同舟云学术

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Additive-free electroless deposition on graphene/copper foil: Photo-induced and defect-assisted approach for environmentally friendly plating

Published:2024-02 Issue:1 Volume:12 Page:111741
ISSN:2213-3437
Container-title:Journal of Environmental Chemical Engineering
language:en
Short-container-title:Journal of Environmental Chemical Engineering

Author:

Chen Hsiao-Chien,Shabir Abdul,Tu Kun-Hua,Tan Cher Ming,Chiu Wei-Hao,Fan Ruei-Cheng,Baruah Nilim Akash

Funder

Chang Gung University

Ministry of Science and Technology, Taiwan

Chang Gung Memorial Hospital, Linkou

Chang Gung Memorial Hospital

National Science and Technology Council

Publisher

Elsevier BV

Subject

Process Chemistry and Technology,Pollution,Waste Management and Disposal,Chemical Engineering (miscellaneous)

Reference49 articles.

1. Co-treatment of electroplating sludge, copper slag, and spent cathode carbon for recovering and solidifying heavy metals;Yu;J. Hazard. Mater.,2021

2. An electroless nickel plating fabric coated with photothermal Chinese ink for powerful passive anti-icing/icephobic and fast active deicing;Zhang;Chem. Eng. J.,2022

3. Self-patterning of highly stretchable and electrically conductive liquid metal conductors by direct-write super-hydrophilic laser-induced graphene and electroless copper plating;Wang;ACS Appl. Mater. Interfaces,2023

4. Electrochemical degradation of Ni-EDTA complexes in electroless plating wastewater using PbO2-Bi electrodes;Rong;Chem. Eng. J.,2022

5. Shape/size-controlled syntheses of metal nanoparticles for site-selective modification of carbon nanotubes;Qu;J. Am. Chem. Soc.,2006

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