SOI wafer flow process for stencil mask fabrication-Reference-Cited by-同舟云学术

SOI wafer flow process for stencil mask fabrication

Published:1999-05 Issue:1-4 Volume:46 Page:473-476
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Butschke J.,Ehrmann A.,Höfflinger B.,Irmscher M.,Käsmaier R.,Letzkus F.,Löschner H.,Mathuni J.,Reuter C.,Schomburg C.,Springer R.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Ion Projection Lithography;Löschner,1997

2. I. W. Rangelow et al., “PN-junction Based Water Flow Process for Stencil Mask Fabrication”, EIPBN'98

3. NaßchemischeÄtzprozesse z. Mikrostrukturierung des Siliziums für die Mikromechanik;Shi;Diss.,1994

4. TSI Process at and below Quarter Micron Resolution and Pattern Transfer into Metal;Irmscher,1997

5. Patent IMS Chips

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