Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Interconnect scaling—the real limiter to high performance ULSI;Bohr;Solid State Technol.,1996
2. A scalable multilevel metallization with pillar interconnections and interlevel dielectric planarization;Castel;J. Electrochem. Soc.,1990
3. High-density plasma CVD and CMP for 0.25 μm intermetal dielectric processing;Pye;Solid State Technol.,1995
4. Plasma etching of aluminium metallizations for ultralarge scale integrated circuits;Riley;J. Electrochem. Soc.,1993
5. An anodic process for forming planar interconnection metallization for multilevel LSI;Schwartz;J. Electrochem. Soc.,1975
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