Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film-Reference-Cited by-同舟云学术

Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film

Published:2002-10 Issue:1-4 Volume:64 Page:367-374
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Travaly Y,Eyckens B,Carbonel L,Rothschild A,Le Q.T,Brongersma S.H,Ciofi I,Struyf H,Furukawa Y,Stucchi M,Schaekers M,Bender H,Rosseel E,Vanhaelemeersch S,Maex K,Gaillard F,Van Autryve L,Rabinzohn P

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. W.W. Lee, P.S. Ho, Material Research Society (MRS) Bulletin Vol. 22, No. 10, October 1997.

2. R.A. Donaton, H. Struyf, M. Lepage, B. Coenegrachts, M. Stucchi, D. De Roest, M.R. Baklanov, S. Vanhaelemeersch, K. Maex, F. Gaillard, L.-Q. Xia, T.-H. Lim, M. Gotuaco, E. Yieh, L. Van Autryve, in: D. Edelstein, G. Dixit, Y. Yasuda, T. Ohba (Eds.), Advanced Metallization Conference (AMC), San Diego, 2000, pp. 595–601.

3. S. Hens, H. Bender, R.A. Donaton, K. Maex, S. Vanhaelemeersch, J. Van Landuyt, in: Proceedings of the Twelfth International Conference on Microscopy of Semiconducting Materials, Oxford 25–29/3/01, Inst. Phys. Conf. Ser. (in press).

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Plasma Surface Treatment on the Self-forming Barrier Process in Porous SiOCH;MRS Proceedings;2008

2. On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance;IEEE Transactions on Semiconductor Manufacturing;2007-08

3. Electrical Equivalent Sidewall Damage in Patterned Low-k Dielectrics;Electrochemical and Solid-State Letters;2004