A descriptive review of the thermal transport mechanisms in mono and hybrid nanofluid-filled heat pipes and current developments
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes
Reference79 articles.
1. Heat pipe based systems - Advances and applications;Jouhara;Energy.,2017
2. Experimental investigation of oscillating heat pipe efficiency for a novel condenser by using Fe3O4 nanofluid;Davari;J. Therm. Anal. Calorim.,2020
3. Experimental study of the thermal characteristics of a heat pipe;Mahdavi;Exp. Therm. Fluid Sci.,2018
4. Experimental study of using Al2O3/methanol nanofluid in a two phase closed thermosyphon (TPCT) array as a novel photovoltaic/thermal system;Moradgholi;Sol. Energy.,2018
5. Experimental study on heat transfer performance of pulsating heat pipes with hybrid working fluids;Xu;Int. J. Heat Mass Transf.,2020
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