Author:
Bloom I.,Givant A.,Lusky E.,Shappir A.,Janai M.,Eitan B.
Reference34 articles.
1. Chandrasekaran, N., 2013. Challenges in 3D memory manufacturing and process integration. IEDM-Electron Devices Meeting Technical Digest. IEEE International, pp. 344–348.
2. Goda, A., Parat, K., 2012. Scaling directions for 2D and 3D NAND cells. IEDM–Electron Devices Meeting Technical Digest. IEEE International, pp. 13–16.
3. Spansion® Inc. press release, 2007. Spansion Inc. to Acquire Long-term Partner Saifun Semiconductor. http://news.spansion.com/index.php?s=20133&item=45050.
4. Spansion® publication, 2008. MirrorBit® Technology: The Foundation for Value-Added Flash Memory Solutions.
5. Spansion® Inc. press release, 2013. Spansion and XMC Semiconductor Announce 32nm Flash Memory Partnership. http://news.spansion.com/2013-03-18-Spansion-and-XMC-Semiconductor-Announce-32nm-Flash-Memory-Partnership.
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1. Memory reliability for cells with strong bit-coupling interference;Proceedings of the International Symposium on Memory Systems;2017-10-02