Effective Parameters for the Success of Severe Plastic Deformation Methods
Author:
Publisher
Elsevier
Reference175 articles.
1. Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening;Huang;Acta Mater,2001
2. Lattice defect investigation of ECAP-Cu by means of X-ray line profile analysis, calorimetry and electrical resistometry;Schafler;Mater Sci Eng A,2005
3. Bulk nanostructured materials from severe plastic deformation;Valiev;Prog Mater Sci,2000
4. Specific features of the strengthening during severe plastic deformation of supersaturated solid solutions;Sergey;Mater Sci Forum,2006
5. Evolution of microstructure, macrotexture and mechanical properties of commercially pure Ti during ECAP-conform processing and drawing;Gunderov;Mater Sci Eng A,2013
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructural Evolution and Mechanical Properties of Multi-layered Aluminum Alloy 6061 Processed by Accumulative Roll Bonding;Journal of Materials Engineering and Performance;2024-06-06
2. Nanoscale visualization of high-angle misorientations in quartz-rich rocks using SEM-EBSD and Atomic Force Microscopy;Journal of Structural Geology;2024-06
3. Microstructure and property evolution during tempering of a medium carbon bainitic steel;Materials Science and Technology;2024-04-16
4. A novel approach in mechanical nanostructuring synthesis of metal hydride: Hydrogen sorption enhancement by High Pressure Torsion Extrusion;International Journal of Hydrogen Energy;2024-01
5. Delayed surface degradation in W-Ta alloys at 400 °C under high-fluence 40 eV He plasma exposure;Fusion Engineering and Design;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3