Author:
Jouhara Hussam,Reay David,McGlen Ryan,Kew Peter,McDonough Jonathan
Reference13 articles.
1. R.S. Gaugler, US Patent 2350348. Applied 21 December 1942, 6 June 1944.
2. G.M. Grover, US Patent 3229759, 1963.
3. Structures of very high thermal conductance;Grover;J. App. Phys.,1964
4. C.C. Roberts, A review of heat pipe liquid delivery concepts, Advances in Heat Pipe Technology. Proceedings of Fourth International Heat Pipe Conference, Pergamon Press, Oxford, 1981.
5. D.A. Reay, Microfluidics Overview. Paper presented at Microfluidics Seminar, East Midlands Airport, UK, April 2005. TUV-NEL, East Kilbride, 2005.