1. S. Grumbine, M. Cavanaugh, M. Willhoff, E. Shen. In: 19th International Symposium on Chemical–Mechanical Planarization (CMP), Albany, NY, 2014.
2. Role of Poly(diallyldimethylammonium chloride) in selective polishing of polysilicon over silicon dioxide and silicon nitride films;Penta;Langmuir,2011
3. Charge density and pH effects on polycation adsorption on poly-Si, SiO2, and Si3N4 films and impact on removal during chemical mechanical polishing;Penta;ACS Appl. Mater. Interfaces,2011
4. Role of polycation adsorption in poly-Si, SiO2 and Si3N4 removal during chemical mechanical polishing: effect of polishing pad surface chemistry, colloids and surfaces A;Penta;Physicochem. Eng. Aspects,2011
5. Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films