Design rule of indium bump in infrared focal plane array for longer cycling life-Reference-Cited by-同舟云学术

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Design rule of indium bump in infrared focal plane array for longer cycling life

Published:2016-05 Issue: Volume:76 Page:631-635
ISSN:1350-4495
Container-title:Infrared Physics & Technology
language:en
Short-container-title:Infrared Physics & Technology

Author:

Zhang Xiaoling,Meng Chao,Zhang Wei,Lv Yanqiu,Si Junjie,Meng Qingduan

Funder

Young Scientists Fund of the National Natural Science Foundation of China

Aero Science Foundation of China

Publisher

Elsevier BV

Subject

Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Infrared sensors for ballistic missile defense

2. Orion II: the second-generation readout multiplexer for largest infrared hybrid focal plane

3. Hybrid active pixel sensors in infrared astronomy

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of flip-chip bonding electrical connectivity for ultra-large array infrared detector;Optics Express;2024-03-11

2. Thermally grown indium (In) thin-film for creating ohmic contact and In-bumps for HgCdTe-based IR detectors;Applied Surface Science;2022-09

3. Calculation and verification of thermal stress in InSb focal plane arrays detector;Optical and Quantum Electronics;2017-11-13

4. Local delamination of InSb IRFPAs in liquid nitrogen shock tests;Infrared Physics & Technology;2017-11

5. Operation limitation of CMP in back-thinning process of InSb IRFPAs;Optical and Quantum Electronics;2017-05-18

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