The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics
Reference18 articles.
1. Flow distributions in manifolds
2. A Model for Flow Distribution in Manifolds
3. Flow Distribution Manifolds
4. Flow distribution and pressure drop in plate heat exchangers—I U-type arrangement
5. Solutions for Lateral Outflow in Perforated Conduits
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4. NUMERICAL STUDIES ON THE FLOW AND TEMPERATURE MALDISTRIBUTION IN A MICROCHANNEL HEAT SINK WITH SUBSTRATE CONDUCTION;Proceeding of 9th Thermal and Fluids Engineering Conference (TFEC);2024
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