Subject
Industrial and Manufacturing Engineering,Computer Science Applications,General Mathematics,Software,Control and Systems Engineering
Reference31 articles.
1. General information on solder paste—technical report;Itoh,2005
2. Six sigma for electronics design and manufacturing;Shina,2002
3. Using statistically designed experiments for process development and improvement: an application in electronics manufacturing;Montgomery;Robotics and Computer Integrated Manufacturing,2000
4. Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing;He;Journal of Materials Science,2003
5. A study of solder paste printing requirements for CSP technology;Kennedy;Soldering and Surface Mount Technology,2000
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