Author:
Yen Yu-Tang,Fang Te-Hua,Lin Yu-Cheng
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,General Mathematics,Software,Control and Systems Engineering
Reference21 articles.
1. Thermal characterization of a taper carrier package;Pope;IEEE Trans Components Packag Technol,1995
2. The development of a new resins either high mechanical strength at a high temperature of TCP’s;Iwane;In: Proc 47th IEEE Electron Components Technol Conf,1998
3. A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process;Jang;Microelectron Reliab,2006
4. Screen printing for the fabrication of organic light-emitting devices;Jabbour;IEEE J Sel Top Quantum Electron,2001
5. Effect of surface energies on screen printing resolution;Liang;IEEE Trans Components Packag Technol,1996
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