An inspection and classification method for chip solder joints using color grads and Boolean rules

Author:

Wu Fupei,Zhang Xianmin

Funder

Foundation for Distinguished Young Talents in Higher Education of Guangdong

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,General Mathematics,Software,Control and Systems Engineering

Reference18 articles.

1. Solder joints inspection using a neural network and fuzzy rule-based classification method;Ko;IEEE Trans Electron Packag Manuf,2000

2. A neurofuzzy method for the evaluation of soldering global quality index;Giaquinto;IEEE Trans Ind Inf,2009

3. Solder joint inspection method for chip component using improved adaboost and decision tree;Xie;IEEE Trans Compon Packag Manuf Technol,2011

4. Design and development of automatic visual inspection system for PCB manufacturing;Mar;Robot Comput Integr Manuf,2011

5. A tiered-color illumination approach for machine inspection of solder joints;Capson;IEEE Trans Pattern Anal Mach Intell,1988

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