Determination of Si and Cu in Al target metal used in a semiconductor process by inductively coupled plasma-atomic emission spectrometry
Author:
Publisher
Elsevier BV
Subject
Spectroscopy,Environmental Chemistry,Biochemistry,Analytical Chemistry
Reference17 articles.
1. Thermal desorption spectroscopic analysis for residual chlorine on Al–Si–Cu after Cl2 electron cyclotron resonance plasma etching
2. Performance of the plasma deposited tungsten nitride barrier to prevent the interdiffusion of Al and Si
3. Impedance‐Spectroscopy Response and Breakdown Potential of Aluminum‐Copper Alloys
4. Residue formation and elimination in chlorine-based plasma etching of Al–Si–Cu interconnections
5. Impedance‐Spectroscopy Response of Aluminum‐Copper‐Silicon Alloys
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