III-V/Si photonics by die-to-wafer bonding-Reference-Cited by-同舟云学术

III-V/Si photonics by die-to-wafer bonding

Published:2007-07 Issue:7-8 Volume:10 Page:36-43
ISSN:1369-7021
Container-title:Materials Today
language:en
Short-container-title:Materials Today

Author:

Roelkens G.,Van Campenhout J.,Brouckaert J.,Van Thourhout D.,Baets R.,Romeo P. Rojo,Regreny P.,Kazmierczak A.,Seassal C.,Letartre X.,Hollinger G.,Fedeli J.M.,Di Cioccio L.,Lagahe-Blanchard C.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference28 articles.

1. Nanophotonic waveguides in silicon-on-insulator fabricated with CMOS technology

2. Linear and Nonlinear Nanophotonic Devices Based on Silicon-on-Insulator Wire Waveguides

3. Very Compact Arrayed-Waveguide-Grating Demultiplexer Using Si Photonic Wire Waveguides

4. Ultra-low loss photonic integrated circuit with membrane-type photonic crystal waveguides

5. Waveguides, resonators and their coupled elements in photonic crystal slabs

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