In situ residual stress analysis in a phenolic resin and copper composite material during curing
Author:
Funder
Japan Synchrotron Radiation Research Institute
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference37 articles.
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4. Evolution of residual stresses in modified epoxy resins for electronic packaging applications;Sham;Composites Part A,2004
5. Mechanisms generating residual stresses and distortion during manufacture of polymer-matrix composite structures;Wisnom;Composites Part A,2006
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