Curing behavior and microstructure of epoxy-POSS modified novolac phenolic resin with different substitution degree-Reference-Cited by-同舟云学术

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Curing behavior and microstructure of epoxy-POSS modified novolac phenolic resin with different substitution degree

Published:2019-09 Issue: Volume:178 Page:121587
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Lei Zixuan,Ji Jingru,Wu Qianqiu,Zhang Junjie,Wang Yixun,Jing Xinli,Liu Yuhong

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference50 articles.

1. In situ chemical reduction and functionalization of graphene oxide for electrically conductive phenol formaldehyde composites;Yuan;Carbon,2014

2. Phenolic resins: 100Years and still going strong;Pilato;React. Funct. Polym.,2013

3. Novel phenolic resins with improved mechanical and toughness properties;Cardona;J. Appl. Polym. Sci.,2012

4. Structure-mechanical property relationships in crosslinked phenolic resin investigated by molecular dynamics simulation;Shudo;Polymer,2017

5. Epoxy/polyhedral oligomeric silsesquioxane (POSS) hybrid networks cured with an anhydride: cure kinetics and thermal properties;Teo;Polymer,2007

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