Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes-Reference-Cited by-同舟云学术

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Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes

Published:2021-01 Issue: Volume:212 Page:123115
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Kourakata Yumi,Onodera Tsunenobu,Kasai Hitoshi,Jinnai Hiroshi,Oikawa Hidetoshi

Funder

Japan Society for the Promotion of Science (JSPS) KAKENKI, Japan

Japan Science and Technology Agent

Core Research for Evolutional Science and Technology (CREST), Japan

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference43 articles.

1. Low-k dielectric materials;Shamiryan;Mater. Today,2004

2. Low dielectric constant materials for microelectronics;Maex;J. Appl. Phys.,2003

3. Evaluation of ultra-low-k dielectric materials for advanced interconnects;Jin;J. Electron. Mater.,2001

4. Low dielectric constant polymers for microelectronics;Maier;Prog. Polym. Sci.,2001

5. Dielectric properties of polyimide/SiO2 hollow spheres composite films with ultralow dielectric constant;Hong;Mater. Sci. Eng., B,2016

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