Measurement of the Young's modulus of moulding compounds at elevated temperatures with a resonance method-Reference-Cited by-同舟云学术

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Measurement of the Young's modulus of moulding compounds at elevated temperatures with a resonance method

Published:2005-04 Issue:2 Volume:24 Page:137-143
ISSN:0142-9418
Container-title:Polymer Testing
language:en
Short-container-title:Polymer Testing

Author:

Schmidt Roland,Alpern Peter,Tilgner Rainer

Publisher

Elsevier BV

Subject

Polymers and Plastics,Organic Chemistry

Reference26 articles.

1. Microelectronic Packaging Handbook,1989

2. Electronic Materials Handbook, Volume 1 Packaging,1989

3. Reliability and Failure of Electronic Materials and Devices;Ohring,1998

4. Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering;Fukuzawa,1985

5. Investigation of the adhesion strength between molding compound and leadframe at higher temperatures;Schmidt,1998

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2. Pathways for Alkali Ion Transport in Mold Compounds;ECS Journal of Solid State Science and Technology;2020-06-03

3. Effect of composition on in vitro degradability of Ti–Mg metal-metal composites;Materials Science and Engineering: C;2020-02

4. Assessment of Dynamic Young’s Modulus and Damping Ratio of Bamboo Fiber Reinforced Polymer Composites using Shock Wave;Advances in Mechanism and Machine Science;2019

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