On the characterization of tensile creep resistance of polyamide 66 nanocomposites. Part II: Modeling and prediction of long-term performance
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference25 articles.
1. On the characterization of tensile creep resistance of polyamide 66 nanocomposites. Part I: experimental results and general discussions;Yang;Polymer,2006
2. Equivalent-continuum modeling of nano-structured materials;Odegard;Compos Sci Technol,2002
3. Modeling and characterization of damping in carbon nanofiber/polypropylene composites;Finegan;Compos Sci Technol,2003
4. Computational materials: multi-scale modeling and simulation of nanostructured materials;Gates;Compos Sci Technol,2005
5. Prediction of elastic properties of carbon nanotube reinforced composites;Hu;Proc Roy Soc A Math Phys Eng Sci,2005
Cited by 160 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Creep resistance enhancement and modeling of 3D printed Polyetherimide/carbon black composites;Composite Structures;2024-10
2. Effect of plasma treatment on hygrothermal creep behaviour of flax fibre composite;Composites Part A: Applied Science and Manufacturing;2024-10
3. Influence of fiber orientation on the behavior of macro synthetic fiber in short- and long-term pullout tests;Materials and Structures;2024-09-04
4. Lifespan prediction of glass fiber reinforced polymers subjected to flexural creep and elevated temperatures using analytical and numerical analyses;Polymer Composites;2024-08-23
5. Modeling the Fundamental Viscoelastic Properties of Polylactic Acid (PLA) and PLA/Nanocomposites in a Unified Manner;Nanomaterials;2024-06-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3