Investigation of Collision Surfaces and Weld Interface in Magnetic Pulse Welding of Dissimilar Al/Cu Sheets
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Reference37 articles.
1. Intermetallic compound growth and stress development in Al-Cu diffusion couple;Mishler;J Electron Mater,2018
2. Growth rate of Intermetallic Compounds in Al / Cu bimetal produced by cold roll welding process;Abbasi;J Alloys Compd,2001
3. Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires;Hug;Mater Sci Eng A,2011
4. Solid-state bonding between Al and Cu by vacuum hot pressing;Lee;Trans Nonferrous Met Soc China,2013
5. Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer;Xiong;Vacuum,2018
Cited by 43 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. An innovative coil for magnetic pulse welding of dissimilar sheet metals: Numerical simulation and experiments;Journal of Materials Processing Technology;2024-03
2. Shock effects on the upper limit of the collision weld process window;Advances in Manufacturing;2024-01-27
3. Decouple the effect of the horizontal and vertical components of the collision velocity on interfacial morphology in electromagnetic pulse welding;Journal of Materials Processing Technology;2023-12
4. Interface formation and defect elimination mechanism of T2/304L interface during electromagnetic pulse welding process;Materials Letters;2023-10
5. Tensile and microstructural behavior of gas-tungsten-arc-welded electrolytic tough pitch copper joints;Emerging Materials Research;2023-09-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3