Study of Peck drilling of borosilicate glass with μRUM process for MEMS-Reference-Cited by-同舟云学术

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Study of Peck drilling of borosilicate glass with μRUM process for MEMS

Published:2016-04 Issue: Volume:22 Page:134-150
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Jain Anil Kumar,Pandey Pulak M.

Funder

Shri Koshy M. George

Shri Shibu Gopinath

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference21 articles.

1. Micro-hole drilling in Pyrex wafer for high-pressure micro valve application;Rakesh,2009

2. Effect of machining parameters on BK7 optical glass using conventional and rotary ultrasonic machines;Hamzah;J JSEM,2008

3. Fabrication of microstructures by powder blasting;Wensink,2002

4. Wafer level chip scale packaging using wafer bonder;Upadhyaya,2005

5. Study of micro rotary ultrasonic machining;Sarwade,2010

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Surface Roughness Analysis for Peck Drilling Process on AZ31;Lecture Notes in Mechanical Engineering;2023

2. Experimental Investigation of Thrust Force in the Drilling of Titanium Alloy Using Different Machining Techniques;Metals;2022-11-07

3. A Study of Microdrilling of Fused Silica Using EDMed PCD Tools;Applied Sciences;2022-11-03

4. Analytical and experimental investigation on cutting force in longitudinal-torsional coupled rotary ultrasonic machining zirconia ceramics;The International Journal of Advanced Manufacturing Technology;2022-03-12

5. Experimental investigations of magnetic field-assisted high-speed electrochemical discharge drilling;Materials and Manufacturing Processes;2021-12-29

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