Use of chemical oxidizers with alumina slurry in Double Disk Magnetic Abrasive Finishing for improving surface finish of Si (100)
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Reference18 articles.
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2. Chemical mechanical planarization for microelectronics applications;Zantye;Mater Sci Eng R Rep,2004
3. Material removal mechanism in chemical mechanical polishing: theory and modeling;Luo;IEEE Trans Semicond Manuf,2001
4. A micro-contact and wear model for chemical – mechanical polishing of silicon wafers;Zhao;Wear,2002
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