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Interfacial voids and microstructure evolution, bonding behavior and deformation mechanism of TC4 diffusion bonded joints

  • Published:2022-09 Issue: Volume:81 Page:837-851
  • ISSN:1526-6125
  • Container-title:Journal of Manufacturing Processes
  • language:en
  • Short-container-title:Journal of Manufacturing Processes

Author:

Peng Yu,Li Jinglong,Li Zhaoxi,Li Shiwei,Guo Wei,Gao Xiangyu,Xiong Jiangtao

Funder

Natural Science Foundation of Shaanxi Province

Natural Science Basic Research Program of Shaanxi Province

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference48 articles.

1. Low cost method of making superplastically formed and diffusion bonded structures;Goss,1985

2. Design, simulation, and testing of a novel micro-channel heat exchanger for natural gas cooling in automotive applications;Dend;Appl Therm Eng,2017

3. The superplastic forming/diffusion bonding of TA7 titanium alloy for manufacturing hollow structure with stiffeners;Du;J Manuf Process,2022

4. Common mechanical properties of diffusion bonded joints and their corresponding microstructure features;Xiong;J Mater Eng Perform,2020

5. Modeling void closure in solid-state diffusion bonding of TC4 alloy;Yuan;Vacuum,2019
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