Metal microchannel lamination using surface mount adhesives for low-temperature heat exchangers

Author:

Paulraj Prawin,Paul Brian K.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference25 articles.

1. Micro energy and chemical systems and multi-scale fabrication;Paul,2005

2. Understanding limits on fin aspect ratios in counterflow microchannel arrays produced by diffusion bonding;Paul;J Manuf Sci Eng,2006

3. Application of surface mount processes for economical production of high-aspect-ratio microchannel arrays;Sharma;J Manuf Processes,2005

4. Azar K. Advanced cooling concepts and their challenges. In: Therminic 2002. 2002. Retrieved April 30, 2007 from: www.qats.com.

5. Ortega A. Air cooling of electronics: a personal perspective 1981–2001. In: IEEE Semitherm. 2002.

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