Modeling of thermal damage and residual stress in slicing of silicon wafers using wire-electrical discharge machining: Comparison with experiments-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Modeling of thermal damage and residual stress in slicing of silicon wafers using wire-electrical discharge machining: Comparison with experiments

Published:2023-01 Issue: Volume:85 Page:69-79
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Rana Pinal,Bhartiya Divyanshu,Marla Deepak

Funder

Indian Institute of Technology Bombay

National Centre for Photovoltaic Research and Education

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference47 articles.

1. Ultra thin silicon wafer slicing using wire-EDM for solar cell application;Joshi;Mater Des,2017

2. Investigation of micro-EDM material removal characteristics using single RC-pulse discharges;Wong;J Mater Process Technol,2003

3. Theoretical models of the electrical discharge machining process. I. A simple cathode erosion model;DiBitonto;J Appl Phys,1989

4. Theoretical models of the electrical discharge machining process. II. the anode erosion model;Patel;J Appl Phys,1989

5. Theoretical models of the electrical discharge machining process. III. the variable mass, cylindrical plasma model;Eubank;J Appl Phys,1993

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A computational model to understand the interaction of nanosecond pulsed laser with ultra-thin SiNx layer-coated silicon substrate;Journal of Manufacturing Processes;2024-06

2. Research on microstructure evolution and surface quality of WEDM for magnetic refrigerant rare-earth gadolinium;Surface Topography: Metrology and Properties;2024-03-01

3. Machining of EN19 steel using cryogenically cooled electrode material in electric discharge machining;Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering;2023-12-12

4. Surface and subsurface integrity of monocrystalline silicon in impulse-discharge driven abrasive machining;Journal of Materials Processing Technology;2023-12

5. Working towards the minimum surface damages and failure analysis of Joule heat effects in manufacturing diamond cutting tools;Engineering Failure Analysis;2023-10

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3