Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification-Reference-Cited by-同舟云学术

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Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification

Published:2020-10 Issue: Volume:58 Page:1034-1038
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Zhao Wanqi,Lin Panpan,Lin Tiesong^ORCID,He Peng^ORCID,Liu Yan,Long Weimin,Li Jian

Funder

National Key Research Project

National Natural Science Foundation of China (NSFC

Natural Scientific Research Innovation Foundation in Harbin Institute of Technology (HIT

China Postdoctoral Science Foundation funded Project

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference22 articles.

1. Recent developments in the research of shape memory alloys

2. A review of shape memory alloy research, applications and opportunities

3. Manufacturing and processing of NiTi implants: A review

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An efficient method to engage oxide ceramics in low-temperature interfacial reactions: Microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint;Journal of Materials Science & Technology;2023-07

2. Solid-state welding of nitinol shape memory alloys: A review;Materials Today Communications;2023-06

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