Optimizing Lumbar Pedicle Screw Trajectory Utilizing a 3D-Printed Drill Guide to Ensure Placement of Pedicle Screws Into Higher Density Bone May Improve Pedicle Screw Pullout Resistance
Author:
Publisher
Elsevier BV
Subject
Neurology (clinical),Surgery
Reference19 articles.
1. Structural characteristics of the pedicle and its role in screw stability;Hirano;Spine (Phila Pa 1976),1997
2. Effects of bone mineral density on pedicle screw fixation;Halvorson;Spine (Phila Pa 1976),1994
3. Diagnostic efficacy of Hounsfield units in spine CT for the assessment of real bone mineral density of degenerative spine: correlation study between T-scores determined by DEXA scan and Hounsfield units from CT;Choi;Acta Neurochir (Wien),2016
4. Measurement techniques and utility of Hounsfield unit values for assessment of bone quality prior to spinal instrumentation: a review of current literature;Zaidi;Spine (Phila Pa 1976),2019
5. 3D printed anatomical (bio)models in spine surgery: clinical benefits and value to health care providers;Parr;J Spine Surg,2019
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. The Influence of Increased Pedicle Screw Diameter and Thicker Rods on Surgical Results in Adolescents Undergoing Posterior Spinal Fusion for Idiopathic Scoliosis;Journal of Clinical Medicine;2024-04-10
2. 3D-printed Titanium Prosthetic Reconstruction of Unilateral Bone Deficiency After Surgical Resection of Tumor Lesions in the Upper Cervical Spine;Clinical Spine Surgery: A Spine Publication;2023-06-07
3. Biomechanical characteristics of 2 different posterior fixation methods of bilateral pedicle screws: A finite element analysis;Medicine;2022-09-09
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