Application of diamond substrates for advanced high density packaging-Reference-Cited by-同舟云学术

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Application of diamond substrates for advanced high density packaging

Published:1993-04 Issue:5-7 Volume:2 Page:1051-1058
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Eden Richard C.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. Application of synthetic diamond substrates for thermal management of high performance electronic multi-chip modules;Eden,1991

2. White CVD diamond for thermal and optical applications;Lu;Diamond Relat. Mater.,1993

3. CRAY-3: a GaAs implemented supercomputer system;Kiefer,1987

4. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981

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1. Diamond thin films integrated with flexible substrates and their physical, chemical and biological characteristics;Journal of Physics D: Applied Physics;2021-07-09

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4. Effect of Microwave Plasma Process Conditions on Nanocrystalline Diamond Deposition on AIGaN/GaN HEMT and Si Device Metallizations;Ceramic Transactions Series;2012-09-27

5. Particle Detectors in Materials Science;Handbook of Particle Detection and Imaging;2012

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