Headspace fingerprint as a potential multivariate intrinsic indicator to monitor temperature variation of thermal in-pack processes: A case-study on broccoli puree-Reference-Cited by-同舟云学术

Headspace fingerprint as a potential multivariate intrinsic indicator to monitor temperature variation of thermal in-pack processes: A case-study on broccoli puree

Published:2018-08 Issue: Volume:48 Page:122-130
ISSN:1466-8564
Container-title:Innovative Food Science & Emerging Technologies
language:en
Short-container-title:Innovative Food Science & Emerging Technologies

Author:

Grauwet Tara,Shpigelman Avi^ORCID

Funder

KULeuven Research Fund

Research Foundation Flanders

Laura Gurwin Flug Fund

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemistry,Food Science

Reference33 articles.

1. Modeling heat transfer in thermal processing: Retort pouches;Almonacid,2009

2. Temperature distribution at the surface of cans in an industrial scale static retort during saturated steam sterilization;Assan;Food Science and Technology Research,2000

3. Process optimization strategies to diminish variability in the quality of discrete packaged foods during thermal processing;Baucour;Journal of Food Engineering,2003

4. Evaluation of furosine, lactulose and acid-soluble β-lactoglobulin as time temperature integrators for whipping cream samples at retail in Austria;Boitz;International Dairy Journal,2015

5. The enzymic and chemically induced decomposition of glucosinolates;Bones;Phytochemistry,2006

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Understanding retort processing: A review;Food Science & Nutrition;2023-12-27

2. Assessment and outlook of variable retort temperature profiles for the thermal processing of packaged foods: Plant productivity, product quality, and energy consumption;Journal of Food Engineering;2020-06

3. High‐pressure processing, microwave, ohmic, and conventional thermal pasteurization: Quality aspects and energy economics;Journal of Food Process Engineering;2019-11-29