1. The effect of grain boundary migration on the formation of intercrystalline voids during creep;Chen;Trans. A.I.M.E.,1960
2. The low cycle fatigue behavior of OFHC copper and a copper - dispersion alloy at elevated temperatures;Cocks;J. Aust. Inst. Metals,1975
3. Cyclic grain boundary migration during high temperature fatigue - I. Microstructural Observations;Langdon;Acta Metall.,1983
4. Cyclic grain boundary migration during high temperature fatigue - II. Measurements of grain boundary sliding;Langdon;Acta Metall.,1983
5. Grain boundary effects in high temperature fatigue.;Langdon,1986